Method for plasma enhanced bonding and bonded structures formed by plasma enhanced bonding

Details for Australian Patent Application No. 2005299977 (hide)

Owner Hewlett-Packard Development Company, L.P.

Inventors Hellekson, Ronald A.; Snyder, Barry C.; Chen, Chien-Hua

Agent Shelston IP

Pub. Number AU-B-2005299977

PCT Pub. Number WO2006/047052

Priority 10/977,141 29.10.04 US; 60/622,062 26.10.04 US

Filing date 4 October 2005

Wipo publication date 4 May 2006

Acceptance publication date 30 September 2010

International Classifications

B41J 2/16 (2006.01) Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed - Production of nozzles

H01L 21/20 (2006.01) Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 21/58 (2006.01) Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

17 May 2007 PCT application entered the National Phase

  PCT publication WO2006/047052 Priority application(s): WO2006/047052

30 September 2010 Application Accepted

  Published as AU-B-2005299977

27 January 2011 Standard Patent Sealed

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