Silicon wafer substrate locking stage and silicon wafer substrate temperature measuring method

Details for Australian Patent Application No. 2005264615 (hide)

Owner Intellectual Property Bank Corp. T.P.S. System Co., Ltd. ICF Inc.

Inventors Asano, Kazuo; Okamoto, Ryuji; Murakami, Yukihiro

Agent Shelston IP

Pub. Number AU-A-2005264615

PCT Pub. Number WO2006/009278

Priority 2004-215957 23.07.04 JP

Filing date 25 July 2005

Wipo publication date 26 January 2006

International Classifications

H01L 21/26 (2006.01) Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

G01K 1/14 (2006.01) Details of thermometers not specially adapted for particular types of thermometer - Supports

G01K 7/02 (2006.01) Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat - using thermo-electric elements, e.g. thermo-couples

H01L 21/66 (2006.01) Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof - Testing or measuring during manufacture or treatment

Event Publications

15 February 2007 PCT application entered the National Phase

  PCT publication WO2006/009278 Priority application(s): WO2006/009278

25 March 2010 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(e). Examination has been requested or an examination report has issued for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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