Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectrict substrate
Details for Australian Patent Application No. 2005211089 (hide)
International Classifications
Event Publications
27 July 2006 PCT application entered the National Phase
PCT publication WO2005/076680 Priority application(s): WO2005/076680
11 February 2010 Application Accepted
Published as AU-B-2005211089
10 June 2010 Standard Patent Sealed
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