Transient liquid phase bonding using sandwich interlayers

Details for Australian Patent Application No. 2005203437 (hide)

Owner United Technologies Corporation

Inventors Das, Gopal

Agent Watermark

Pub. Number AU-A-2005203437

Priority 10/957,805 04.10.04 US

Filing date 3 August 2005

Wipo publication date 27 April 2006

International Classifications

B23K 35/16 (2006.01) Rods, electrodes, materials, or media, for use in soldering, welding, or cutting

B23K 1/00 (2006.01) Soldering, e.g. brazing, or unsoldering

B23K 35/14 (2006.01) Rods, electrodes, materials, or media, for use in soldering, welding, or cutting

Event Publications

18 August 2005 Complete Application Filed

  Priority application(s): 10/957,805 04.10.04 US

27 April 2006 Application Open to Public Inspection

  Published as AU-A-2005203437

9 April 2009 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(a). A direction to request examination has been given for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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