Method of selecting etching using etch stop layer

Details for Australian Patent Application No. 2005203258 (hide)

Owner IDC, LLC

Inventors Gally, Brian James; Chui, Clarence; Tung, Ming-Hau; Kothari, Manish

Agent Madderns

Pub. Number AU-A-2005203258

Priority 60/613,410 27.09.04 US; 11/090,773 25.03.05 US

Filing date 26 July 2005

Wipo publication date 13 April 2006

International Classifications

C23C 4/06 (2006.01) Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge - Metallic material

B32B 7/00 (2006.01) Layered products characterised by the relation between layers, i.e. products essentially comprising layers having different physical properties or products characterised by the interconnection of layers

B32B 15/00 (2006.01) Layered products essentially comprising metal

C23C 4/10 (2006.01) Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge - Oxides, borides, carbides, nitrides, silicides or mixtures thereof

C23C 16/06 (2006.01) Chemical deposition or plating by decomposition - characterised by the deposition of metallic material

C23C 16/24 (2006.01) Chemical deposition or plating by decomposition

C23C 16/34 (2006.01) Chemical deposition or plating by decomposition - Nitrides

C23C 16/40 (2006.01) Chemical deposition or plating by decomposition - Oxides

C23F 1/02 (2006.01) Etching metallic material by chemical means - Local etching

H01L 21/311 (2006.01) Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

11 August 2005 Complete Application Filed

  Priority application(s): 60/613,410 27.09.04 US; 11/090,773 25.03.05 US

13 April 2006 Application Open to Public Inspection

  Published as AU-A-2005203258

13 November 2008 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(a). A direction to request examination has been given for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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