Micromachining methods and systems

Details for Australian Patent Application No. 2005201310 (hide)

Owner Hewlett-Packard Development Company, L.P.

Inventors Buswell, Shen

Agent Shelston IP

Pub. Number AU-B-2005201310

Priority 10/832030 26.04.04 US

Filing date 24 March 2005

Wipo publication date 10 November 2005

Acceptance publication date 10 June 2010

International Classifications

B23B 37/00 (2006.01) Boring by making use of vibrations of ultrasonic frequency

B23K 26/00 (2006.01) Working by laser beam, e.g. welding, cutting, boring

B23K 26/38 (2006.01) Working by laser beam, e.g. welding, cutting, boring

B24B 1/04 (2006.01) - subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency

B24B 37/00 (2006.01) Lapping machines or devices, i.e. requiring pulverulent abrading substances inserted between a lap of relatively soft but rigid material and the surface to be lapped

B41J 2/14 (2006.01) Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed - Structure thereof

B41J 2/16 (2006.01) Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed - Production of nozzles

B81C 1/00 (2006.01) Manufacture or treatment of devices or systems in or on a substrate

Event Publications

14 April 2005 Complete Application Filed

  Priority application(s): 10/832030 26.04.04 US

10 November 2005 Application Open to Public Inspection

  Published as AU-B-2005201310

10 June 2010 Application Accepted

  Published as AU-B-2005201310

4 November 2010 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under reg. 22.2I(2). This application has been accepted or advertised accepted. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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