Method for manufacturing a midplane

Details for Australian Patent Application No. 2004300569 (hide)

Owner Viasystems Group, Inc.

Inventors Thoolen, Peter J. M.; Speetjens, Frank; Theelen, Roger; Hermkens, Gerald A. J.; Smeets, Marcel

Agent Griffith Hack

Pub. Number AU-A-2004300569

PCT Pub. Number WO2005/004570

Priority 60/485,765 08.07.03 US

Filing date 8 July 2004

Wipo publication date 13 January 2005

International Classifications

H05K 7/14 (2006.01) Constructional details common to different types of electric apparatus - Mounting supporting structure in casing or on frame or rack

H05K 3/00 (2006.01) Apparatus or processes for manufacturing printed circuits

H05K 3/46 (2006.01) Apparatus or processes for manufacturing printed circuits - Manufacturing multi-layer circuits

Event Publications

2 February 2006 PCT application entered the National Phase

  PCT publication WO2005/004570 Priority application(s): WO2005/004570

13 September 2007 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(a). A direction to request examination has been given for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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