Solvent-modified resin system containing filler that has high Tg, transparency and good reliability in wafer level underfill applications

Details for Australian Patent Application No. 2004271534 (hide)

International Classifications

Event Publications

27 April 2006 PCT application entered the National Phase

PCT publication WO2005/024939 Priority application(s): WO2005/024939

3 March 2011 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This application lapsed under section 142(2)(d). Examination has been requested or an examination report has issued for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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