Thin bond-line silicone adhesive composition and method for preparing the same
Details for Australian Patent Application No. 2004270628 (hide)
International Classifications
Event Publications
30 March 2006 PCT application entered the National Phase
PCT publication WO2005/023936 Priority application(s): WO2005/023936
4 February 2010 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired
This application lapsed under section 142(2)(d). Examination has been requested or an examination report has issued for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.
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