Semiconductor package and manufacturing method thereof

Details for Australian Patent Application No. 2004268299 (hide)

Owner Olympus Corporation Fujikura Ltd.

Inventors Yamamoto, Satoshi; Shiotani, Koichi; Matsumoto, Kazuya; Hirafune, Sayaka; Suemasu, Tatsuo; Isokawa, Toshihiko

Agent FB Rice

Pub. Number AU-B-2004268299

PCT Pub. Number WO2005/022631

Priority 2003-419613 17.12.03 JP; 2003-304848 28.08.03 JP

Filing date 25 August 2004

Wipo publication date 10 March 2005

Acceptance publication date 21 May 2009

International Classifications

H01L 23/48 (2006.01) Details of semiconductor or other solid state devices - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leadsĀ or terminal arrangements

H01L 23/12 (2006.01) Details of semiconductor or other solid state devices - Mountings, e.g. non-detachable insulating substrates

H01L 23/538 (2006.01) Details of semiconductor or other solid state devices

H01L 25/065 (2006.01) Assemblies consisting of a plurality of individual semiconductor or other solid state devices - the devices being of a type provided for in group

H01L 29/76 (2006.01) Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier

Event Publications

23 March 2006 PCT application entered the National Phase

  PCT publication WO2005/022631 Priority application(s): WO2005/022631

21 May 2009 Application Accepted

  Published as AU-B-2004268299

17 September 2009 Standard Patent Sealed

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