No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance

Details for Australian Patent Application No. 2004268147 (hide)

International Classifications

Event Publications

27 April 2006 PCT application entered the National Phase

PCT publication WO2005/021647 Priority application(s): WO2005/021647

25 March 2010 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This application lapsed under section 142(2)(d). Examination has been requested or an examination report has issued for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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