Quad-directional-lead flat-package ICmounting printed circuit board, method of soldering quad-directional-lead flatpackage IC, and air conditioning apparatus with quad-directional-lead flatpackage IC-mounting printed circuit board

Details for Australian Patent Application No. 2004237811 (hide)

Owner Mitsubishi Denki Kabushiki Kaisha

Inventors Fukushima, Hironobu; Miura, Tsuyoshi; Mori, Hideki

Agent Griffith Hack

Pub. Number AU-B-2004237811

Priority 2003-412757 11.12.03 JP

Filing date 8 December 2004

Wipo publication date 30 June 2005

Acceptance publication date 19 January 2006

International Classifications

H05K 3/00 (2006.01) Apparatus or processes for manufacturing printed circuits

Event Publications

23 December 2004 Complete Application Filed

  Priority application(s): 2003-412757 11.12.03 JP

30 June 2005 Application Open to Public Inspection

  Published as AU-B-2004237811

19 January 2006 Application Accepted

  Published as AU-B-2004237811

18 May 2006 Standard Patent Sealed

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