Semiconductor device manufacturing method and semiconductor device manufactured by such manufacturing method

Details for Australian Patent Application No. 2004231196 (hide)

Owner Sharp Kabushiki Kaisha

Inventors Takamoto, Tatsuya; Washio, Hidetoshi

Agent Davies Collison Cave

Pub. Number AU-B-2004231196

Priority 2003-390944 20.11.03 JP

Filing date 19 November 2004

Wipo publication date 9 June 2005

Acceptance publication date 19 April 2007

International Classifications

H01L 21/28 (2006.01) Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 21/285 (2006.01) Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 21/308 (2006.01) Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 21/3205 (2006.01) Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 23/58 (2006.01) Details of semiconductor or other solid state devices - Structural electrical arrangements for semiconductor devices not otherwise provided for

H01L 29/41 (2006.01) Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier

Event Publications

9 December 2004 Complete Application Filed

  Priority application(s): 2003-390944 20.11.03 JP

9 June 2005 Application Open to Public Inspection

  Published as AU-B-2004231196

19 April 2007 Application Accepted

  Published as AU-B-2004231196

16 August 2007 Standard Patent Sealed

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