Chip customized polish pads for chemical mechanical planarization (CMP)

Details for Australian Patent Application No. 2004225931 (hide)

Owner Neopad Technologies Corporation

Inventors Misra, Sudhanshu; Roy, Pradip K.

Agent FB Rice

Pub. Number AU-A-2004225931

PCT Pub. Number WO2004/087375

Priority 60/457,273 25.03.03 US

Filing date 25 March 2004

Wipo publication date 14 October 2004

International Classifications

B24B 037/04 Lapping machines or devices, i.e. requiring pulverulent abrading substances inserted between a lap of relatively soft but rigid material and the surface to be lapped - designed for working plane surfaces

B24B 049/02 Measuring - according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent

B24B 053/007 Devices or means for dressing or conditioning abrasive surfaces - Cleaning of grinding wheels

Event Publications

6 October 2005 PCT application entered the National Phase

  PCT publication WO2004/087375 Priority application(s): WO2004/087375

9 August 2007 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(a). A direction to request examination has been given for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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