Via and trench structures for semiconductor substrates bonded to metallic substrates

Details for Australian Patent Application No. 2004219550 (hide)

Owner EpiTactix Pty Ltd

Inventors Cunningham, Shaun Joseph

Agent Pini Patent & Trade Mark Attorneys

Pub. Number AU-A-2004219550

PCT Pub. Number WO2004/082020

Priority 10/634,512 04.08.03 US; 10/389,278 13.03.03 US

Filing date 15 March 2004

Wipo publication date 23 September 2004

International Classifications

H01L 023/52 Details of semiconductor or other solid state devices - Arrangements for conducting electric current within the device in operation from one component to another

H01L 023/66 Details of semiconductor or other solid state devices

H01L 023/36 Details of semiconductor or other solid state devices

H01L 021/76 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

27 October 2005 PCT application entered the National Phase

  PCT publication WO2004/082020 Priority application(s): WO2004/082020

9 August 2007 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(a). A direction to request examination has been given for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

Legal

The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.

Next and Previous Patents/Applications

2004219551-Novel vanadium halide redox flow battery

2004219547-Commodities exchange system and method