Method of reducing rigidity of a substrate

Details for Australian Patent Application No. 2004203187 (hide)

Owner Silverbrook Research Pty Ltd

Inventors Silverbrook, Kia

Agent Silverbrook Research Pty. Ltd.

Pub. Number AU-B-2004203187

Parent 2002213637

Filing date 15 July 2004

Wipo publication date 12 August 2004

Acceptance publication date 28 July 2005

International Classifications

H05K 001/14 Printed circuits - Structural association of two or more printed circuits

H05K 001/18 Printed circuits - Printed circuits structurally associated with non-printed electric components

H01L 023/48 Details of semiconductor or other solid state devices - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements

Event Publications

29 July 2004 Complete Application Filed

12 August 2004 Application Open to Public Inspection

  Published as AU-B-2004203187

28 July 2005 Application Accepted

  Published as AU-B-2004203187

24 November 2005 Standard Patent Sealed

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