An apparatus for fabricating packaged semiconductor devices

Details for Australian Patent Application No. 2004202411 (hide)

Owner Silverbrook Research Pty Ltd

Inventors Silverbrook, Kia

Agent Silverbrook Research Pty Ltd

Pub. Number AU-B-2004202411

Parent 2002216846

Filing date 1 June 2004

Wipo publication date 17 June 2004

Acceptance publication date 10 November 2005

International Classifications

H01L 023/28 Details of semiconductor or other solid state devices - Encapsulation, e.g. encapsulating layers, coatings

B29C 043/04 Compression moulding, i.e. applying external pressure to flow the moulding material - using movable moulds

Event Publications

17 June 2004 Application Open to Public Inspection

  Published as AU-B-2004202411

17 June 2004 Complete Application Filed

10 November 2005 Application Accepted

  Published as AU-B-2004202411

9 March 2006 Standard Patent Sealed

2 August 2012 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This patent ceased under section 143(a), or Expired. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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