METHOD OF CONNECTING MODULE LAYERS SUITABLE FOR THE PRODUCTION OF MICROSTRUCTURE COMPONENTS AND A MICROSTRUCTURE COMPONENT

Details for Australian Patent Application No. 2003304264 (hide)

Owner ATOTECH DEUTSCHLAND GMBH

Inventors FRIZ, Wolfgang; SCHWIEKENDICK, Carsten; RINGTUNATUS, Oliver; MADRY, Christian; MEYER, Heinrich; CRAMER, Konrad; KURTZ, Olaf; HERBER, Ralf

Pub. Number AU-A-2003304264

PCT Number PCT/EP2003/0116

PCT Pub. Number WO2005/002773

Priority 102 51 658.8 01.11.02 DE

Filing date 21 October 2003

Wipo publication date 21 January 2005

International Classifications

B23K 001/20 Soldering, e.g. brazing, or unsoldering - Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating

B81B 007/00 Micro-structural systems

B23K 035/00 Rods, electrodes, materials, or media, for use in soldering, welding, or cutting

Event Publications

24 February 2005 Complete Application Filed

  Priority application(s): 102 51 658.8 01.11.02 DE

3 March 2005 Application Open to Public Inspection

  Published as AU-A-2003304264

21 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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