EPOXY RESIN COMPOSITION, SEMICONDUCTOR DEVICES HAVING CURED LAYERS OF THE COMPOSITION, AND PROCESS FOR PRODUCTION OF THE DEVICES

Details for Australian Patent Application No. 2003303860 (hide)

Owner MATSUSHITA ELECTRIC WORKS, LTD.

Inventors KANAGAWA, Naoki

Pub. Number AU-A-2003303860

PCT Number PCT/JP2003/0012

PCT Pub. Number WO2004/069894

Filing date 6 February 2003

Wipo publication date 30 August 2004

International Classifications

C08G 059/40 Polycondensates containing more than one epoxy group per molecule

C08L 063/00 Compositions of epoxy resins

C08K 003/36 Use of inorganic ingredients

H01L 021/60 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

23 September 2004 Complete Application Filed

30 September 2004 Application Open to Public Inspection

  Published as AU-A-2003303860

20 October 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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