MULTILAYER PRODUCT TO MAKE PRINTED CIRCUIT BOARDS

Details for Australian Patent Application No. 2003303474 (hide)

Owner SENTREX COMPANY

Inventors PASTERNACK, Melvin; WEIMANN, Ludwig

Pub. Number AU-A-2003303474

PCT Number PCT/US2003/0408

PCT Pub. Number WO2004/060033

Priority 60/436,422 24.12.02 US

Filing date 22 December 2003

Wipo publication date 22 July 2004

International Classifications

H05K 003/02 Apparatus or processes for manufacturing printed circuits - in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Event Publications

19 August 2004 Complete Application Filed

  Priority application(s): 60/436,422 24.12.02 US

26 August 2004 Application Open to Public Inspection

  Published as AU-A-2003303474

22 September 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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