Composition and method for copper chemical mechanical planarization

Details for Australian Patent Application No. 2003302769 (hide)

Owner Arkema Inc.

Inventors Martyak, Nicholas M.; Carroll, Glenn; Janney, Patrick K.; Nosowitz, Martin

Agent Phillips Ormonde Fitzpatrick

Pub. Number AU-B-2003302769

PCT Number PCT/US2003/0371

PCT Pub. Number WO2004/055864

Priority 10/706,178 12.11.03 US; 60/430,418 02.12.02 US

Filing date 19 November 2003

Wipo publication date 9 July 2004

Acceptance publication date 26 February 2009

International Classifications

C09G 1/02 (2006.01) Polishing compositions

H01L 21/321 (2006.01) Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

29 July 2004 Complete Application Filed

  Priority application(s): 10/706,178 12.11.03 US; 60/430,418 02.12.02 US

19 August 2004 Application Open to Public Inspection

  Published as AU-B-2003302769

26 February 2009 Application Accepted

  Published as AU-B-2003302769

25 June 2009 Standard Patent Sealed

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