POLISHING PAD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Details for Australian Patent Application No. 2003302299 (hide)

Owner TOYO BOSEKI KABUSHIKI KAISHA

Inventors OGAWA, Kazuyuki; KAZUNO, Atsushi; WATANABE, Kimihiro; NAKAMORI, Masahiko; SHIMOMURA, Tetsuo; YAMADA, Takatoshi

Pub. Number AU-A-2003302299

PCT Number PCT/JP2003/0151

PCT Pub. Number WO2004/049417

Priority 2002-343199 27.11.02 JP; 2003-000331 06.01.03 JP; 2003-029477 06.02.03 JP; 2003-064653 11.03.03 JP

Filing date 27 November 2003

Wipo publication date 18 June 2004

International Classifications

H01L 021/304 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

B24B 037/00 Lapping machines or devices, i.e. requiring pulverulent abrading substances inserted between a lap of relatively soft but rigid material and the surface to be lapped

Event Publications

15 July 2004 Complete Application Filed

  Priority application(s): 2002-343199 27.11.02 JP; 2003-000331 06.01.03 JP; 2003-029477 06.02.03 JP; 2003-064653 11.03.03 JP

22 July 2004 Application Open to Public Inspection

  Published as AU-A-2003302299

1 September 2005 Corrigenda

  Applications OPI - Name Index Under the name TOYO BOSEKI KABUSHIKI KAISHA, Corrigenda Application No. 2003302299, under INID (71) correct the name to read TOYO TIRE & RUBBER CO., LTD.; TOYO BOSEKI KABUSHIKI KAISHA

22 September 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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