METHOD OF ELECTROPLATING COPPER OVER A PATTERNED DIELECTRIC LAYER TO ENHANCE PROCESS UNIFORMITY OF A SUBSEQUENT CMP PROCESS

Details for Australian Patent Application No. 2003302261 (hide)

Owner ADVANCED MICRO DEVICES, INC.

Inventors MAUERSBERGER, Frank; MARXSEN, Gerd, Franz; PREUSSE, Axel; NOPPER, Markus

Pub. Number AU-A-2003302261

PCT Number PCT/US2003/0411

PCT Pub. Number WO2004/097932

Priority 103 19 135.6 28.04.03 DE; 10/666,195 19.09.03 US

Filing date 22 December 2003

Wipo publication date 23 November 2004

International Classifications

H01L 021/768 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/288 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

15 July 2004 Complete Application Filed

  Priority application(s): 103 19 135.6 28.04.03 DE; 10/666,195 19.09.03 US

23 December 2004 Application Open to Public Inspection

  Published as AU-A-2003302261

12 January 2006 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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