Method of manufacturing multi-level contacts by sizing of contact sizes in integrated circuits

Details for Australian Patent Application No. 2003300121 (hide)

Owner Advanced Micro Devices, Inc.

Inventors Aminpur, Massud; Hellig, Kay

Pub. Number AU-A-2003300121

PCT Number PCT/US2003/0416

PCT Pub. Number WO2005/013357

Priority PCT/US03/20872 02.07.03 US; PCT/US03/21282 09.07.03 US

Filing date 30 December 2003

Wipo publication date 15 February 2005

International Classifications

H01L 021/768 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

27 May 2004 Complete Application Filed

  Priority application(s): PCT/US03/20872 02.07.03 US; PCT/US03/21282 09.07.03 US

18 August 2005 Application Open to Public Inspection

  Published as AU-A-2003300121

16 March 2006 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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