A METHOD FOR DEPOSITING A METAL LAYER ON A SEMICONDUCTOR INTERCONNECT STRUCTURE HAVING A CAPPING LAYER

Details for Australian Patent Application No. 2003298347 (hide)

International Classifications

Event Publications

6 May 2004 Complete Application Filed

Priority application(s): 10/318,606 11.12.02 US

5 August 2004 Application Open to Public Inspection

Published as AU-A-2003298347

15 September 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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