NON-POLYMERIC ORGANIC PARTICLES FOR CHEMICAL MECHANICAL PLANARIZATION

Details for Australian Patent Application No. 2003297104 (hide)

Owner DYNEA CHEMICALS OY TANG, Kwok

Inventors CHOWDHURY, Atanu, Roy; CHEEMALAPATI, Krishnayya; BIAN, Guomin; LI, Yazhuo

Pub. Number AU-A-2003297104

PCT Number PCT/US2003/0398

PCT Pub. Number WO2005/014753

Priority 60/485,492 09.07.03 US

Filing date 15 December 2003

Wipo publication date 25 February 2005

International Classifications

H01L 021/321 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/306 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

C09G 001/02 Polishing compositions

H01L 021/3105 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

C09K 003/14 Materials not provided for elsewhere - Anti-slip materials

Event Publications

6 May 2004 Complete Application Filed

  Priority application(s): 60/485,492 09.07.03 US

7 April 2005 Application Open to Public Inspection

  Published as AU-A-2003297104

23 March 2006 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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