METHODS FOR PERFORMING SUBSTRATE IMPRINTING USING THERMOSET RESIN VARNISHES AND PRODUCTS FORMED THEREFROM

Details for Australian Patent Application No. 2003297019 (hide)

Owner INTEL CORPORATION

Inventors COOMER, Boyd

Pub. Number AU-A-2003297019

PCT Number PCT/US2003/0396

PCT Pub. Number WO2004/061955

Priority 10/335,187 31.12.02 US

Filing date 11 December 2003

Wipo publication date 29 July 2004

International Classifications

H01L 023/14 Details of semiconductor or other solid state devices

H05K 003/46 Apparatus or processes for manufacturing printed circuits - Manufacturing multi-layer circuits

Event Publications

6 May 2004 Complete Application Filed

  Priority application(s): 10/335,187 31.12.02 US

2 September 2004 Application Open to Public Inspection

  Published as AU-A-2003297019

15 September 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

Legal

The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.

Next and Previous Patents/Applications

2003297020-MOUNTING CAPACITORS UNDER BALL GRID ARRAY

2003297018-RUN-TIME BEHAVIOR PRESERVING REDUNDANCY ELIMINATION