CURING RESIN COMPOSITION, ADHESIVE EPOXY RESIN PASTE, ADHESIVE EPOXY RESIN SHEET, CONDUCTIVE CONNECTION PASTE, CONDUCTIVE CONNECTION SHEET, AND ELECTRONIC COMPONENT JOINED BODY

Details for Australian Patent Application No. 2003296145 (hide)

International Classifications

Event Publications

29 April 2004 Complete Application Filed

Priority application(s): 2003-001276 07.01.03 JP; 2003-083588 25.03.03 JP; 2003-177221 20.06.03 JP; 2003-177222 20.06.03 JP; 2003-338284 29.09.03 JP; 2003-403703 02.12.03 JP

2 September 2004 Application Open to Public Inspection

Published as AU-A-2003296145

22 September 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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