SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING, METHOD FOR PLANARIZATION OF SURFACE OF SEMICONDUCTOR ELEMENT USING THE SAME, AND METHOD FOR CONTROLLING SELECTION RATIO OF SLURRY COMPOSITION

Details for Australian Patent Application No. 2003296130 (hide)

International Classifications

Event Publications

29 April 2004 Complete Application Filed

Priority application(s): 10-2002-0087934 31.12.02 KR

2 September 2004 Application Open to Public Inspection

Published as AU-A-2003296130

1 September 2005 Corrigenda

Applications OPI - Name Index Under the name SUMITOMO MITSUBISHI SILICON CORPORATION, Application No. 2003296130, under INID (71) correct the name to read HANYANG HAK WON CO., LTD.; SUMITOMO MITSUBISHI SILICON CORPORATION

15 September 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

Legal

The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.