B-STAGEABLE DIE ATTACH ADHESIVES

Details for Australian Patent Application No. 2003295705 (hide)

Owner HENKEL CORPORATION

Inventors FORRAY, Deborah, D.,; LIU, Puwei; DELOS SANTOS, Benedicto, P.,

Pub. Number AU-A-2003295705

PCT Number PCT/US2003/0371

PCT Pub. Number WO2004/048491

Priority 10/459,601 12.06.03 US; 60/428,724 25.11.02 US

Filing date 20 November 2003

Wipo publication date 18 June 2004

International Classifications

C09J 004/00 Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond

C09J 005/06 Adhesive processes in general - involving heating of the applied adhesive

H01L 021/58 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

22 April 2004 Complete Application Filed

  Priority application(s): 10/459,601 12.06.03 US; 60/428,724 25.11.02 US

22 July 2004 Application Open to Public Inspection

  Published as AU-A-2003295705

18 August 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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