METHOD OF CUTTING SEMICONDUCTOR WAFER AND PROTECTIVE SHEET USED IN THE CUTTING METHOD

Details for Australian Patent Application No. 2003295231 (hide)

Owner MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventors ARITA, Kiyoshi

Pub. Number AU-A-2003295231

PCT Number PCT/JP2003/0158

PCT Pub. Number WO2004/053981

Priority 2002-359051 11.12.02 JP

Filing date 11 December 2003

Wipo publication date 30 June 2004

International Classifications

H01L 021/78 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/68 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

C09J 007/02 Adhesives in the form of films or foils - on carriers

Event Publications

22 April 2004 Complete Application Filed

  Priority application(s): 2002-359051 11.12.02 JP

5 August 2004 Application Open to Public Inspection

  Published as AU-A-2003295231

25 August 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

Legal

The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.

Next and Previous Patents/Applications

2003295232-CURABLE COMPOSITION, CURED PRODUCT THEREOF, MOLDED PRODUCT THEREOF AND USE AS FUEL CELL SEPARATOR

2003295230-RECORDING AND REPRODUCING SYSTEM, RECORDING AND REPRODUCTING METHOD, PROGRAM AND RECORD MEDIUM