Thermal interface material and solder preforms

Details for Australian Patent Application No. 2003291827 (hide)

Owner Fry's Metals, Inc.

Inventors Lewis, Brian; Singh, Bawa; Laughlin, John P.; Kyaw, David V.; Ingham, Anthony

Pub. Number AU-A-2003291827

PCT Number PCT/US2003/0376

PCT Pub. Number WO2005/064677

Filing date 25 November 2003

Wipo publication date 21 July 2005

International Classifications

H01L 023/48 Details of semiconductor or other solid state devices - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements

Event Publications

8 April 2004 Complete Application Filed

8 September 2005 Application Open to Public Inspection

  Published as AU-A-2003291827

10 August 2006 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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