STRUCTURE TO REDUCE SIGNAL CROSS-TALK THROUGH SEMICONDUCTOR SUBSTRATE FOR SYSTEM ON CHIP APPLICATIONS

Details for Australian Patent Application No. 2003291553 (hide)

Owner MOTOROLA, INC.

Inventors WELCH, Pamela, J.; HUANG, WenLing, M.; BHARATAN, Sushil; KYONO, Carl; MONK, David, J.; TO, Kun-Hin

Pub. Number AU-A-2003291553

PCT Number PCT/US2003/0365

PCT Pub. Number WO2004/049444

Priority 10/304,493 26.11.02 US

Filing date 14 November 2003

Wipo publication date 18 June 2004

International Classifications

H01L 027/06 Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate - including a plurality of individual components in a non-repetitive configuration

H01L 027/12 Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate - the substrate being other than a semiconductor body, e.g. an insulating body

H01L 021/76 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

8 April 2004 Complete Application Filed

  Priority application(s): 10/304,493 26.11.02 US

22 July 2004 Application Open to Public Inspection

  Published as AU-A-2003291553

11 August 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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