SEMICONDUCTOR DEVICE HAVING A BOND PAD AND METHOD FOR ITS FABRICATION

Details for Australian Patent Application No. 2003291472 (hide)

Owner MOTOROLA, INC., A CORPORATION OF THE STATE OF DELAWARE

Inventors DOWNEY, Susan H.; HARPER, Peter R.; HESS, Kevin; LEONI, Michael, V.; TRAN, Tu-Anh

Pub. Number AU-A-2003291472

PCT Number PCT/US2003/0359

PCT Pub. Number WO2004/049436

Priority 10/304,416 26.11.02 US

Filing date 12 November 2003

Wipo publication date 18 June 2004

International Classifications

H01L 023/485 Details of semiconductor or other solid state devices

H01L 025/065 Assemblies consisting of a plurality of individual semiconductor or other solid state devices - the devices being of a type provided for in group

Event Publications

8 April 2004 Complete Application Filed

  Priority application(s): 10/304,416 26.11.02 US

22 July 2004 Application Open to Public Inspection

  Published as AU-A-2003291472

11 August 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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