A SLURRY COMPOSITION AND A POLISHING METHOD USING THE SAME

Details for Australian Patent Application No. 2003290980 (hide)

Owner EKC TECHNOLOGY, INC.

Inventors NOJO, Haruki; YOSHIDA, Akitoshi; KASHIHARA, Hirofumi; BERAR, Pascal

Pub. Number AU-A-2003290980

PCT Number PCT/US2003/0366

PCT Pub. Number WO2004/044076

Priority JP2002-329464 13.11.02 JP

Filing date 13 November 2003

Wipo publication date 3 June 2004

International Classifications

C09G 001/02 Polishing compositions

H01L 021/3105 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/321 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

8 April 2004 Complete Application Filed

  Priority application(s): JP2002-329464 13.11.02 JP

8 July 2004 Application Open to Public Inspection

  Published as AU-A-2003290980

28 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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