MULTI-LAYER CIRCUIT ASSEMBLY AND PROCESS FOR PREPARING THE SAME

Details for Australian Patent Application No. 2003290633 (hide)

Owner PPG INDUSTRIES OHIO, INC.

Inventors WANG, Alan, E.; OLSON, Kevin, C.

Pub. Number AU-A-2003290633

PCT Number PCT/US2003/0355

PCT Pub. Number WO2004/045262

Priority 10/291,876 08.11.02 US

Filing date 7 November 2003

Wipo publication date 3 June 2004

International Classifications

H05K 003/44 Apparatus or processes for manufacturing printed circuits - Manufacturing insulated metal core circuits

H01L 021/48 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

8 April 2004 Complete Application Filed

  Priority application(s): 10/291,876 08.11.02 US

8 July 2004 Application Open to Public Inspection

  Published as AU-A-2003290633

21 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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