PACKAGE STRUCTURE AND PACKAGING METHOD OF SEMICONDUCTOR DEVICE

Details for Australian Patent Application No. 2003289336 (hide)

Owner GENUSION INC.

Inventors NAKASHIMA, Moriyoshi; KOBAYASHI, Kazuo; AJIKA, Natsuo

Pub. Number AU-A-2003289336

PCT Number PCT/JP2003/0160

PCT Pub. Number WO2005/038917

Priority 2003-359896 20.10.03 JP

Filing date 15 December 2003

Wipo publication date 5 May 2005

International Classifications

H01L 025/065 Assemblies consisting of a plurality of individual semiconductor or other solid state devices - the devices being of a type provided for in group

H01L 025/07 Assemblies consisting of a plurality of individual semiconductor or other solid state devices - the devices being of a type provided for in group

H01L 025/18 Assemblies consisting of a plurality of individual semiconductor or other solid state devices - the devices being of types provided for in two or more different subgroups of the same main group of groups

Event Publications

1 April 2004 Complete Application Filed

  Priority application(s): 2003-359896 20.10.03 JP

23 June 2005 Application Open to Public Inspection

  Published as AU-A-2003289336

6 July 2006 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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