METHOD FOR BORING HOLES IN A SUBSTRATE, ESPECIALLY IN AN ELECTRICAL CIRCUIT SUBSTRATE, BY MEANS OF A LASER BEAM

Details for Australian Patent Application No. 2003287851 (hide)

Owner SIEMENS AKTIENGESELLSCHAFT

Inventors VAN BIESEN, Marc; KILTHAU, Alexander; MAYER, Hans, Jurgen

Pub. Number AU-A-2003287851

PCT Number PCT/DE2003/0035

PCT Pub. Number WO2004/041474

Priority 102 51 480.1 05.11.02 DE

Filing date 27 October 2003

Wipo publication date 7 June 2004

International Classifications

B23K 026/38 Working by laser beam, e.g. welding, cutting, boring

H05K 003/00 Apparatus or processes for manufacturing printed circuits

Event Publications

1 April 2004 Complete Application Filed

  Priority application(s): 102 51 480.1 05.11.02 DE

1 July 2004 Application Open to Public Inspection

  Published as AU-A-2003287851

21 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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