MICROELECTRONIC PACKAGING AND COMPONENTS

Details for Australian Patent Application No. 2003286390 (hide)

Owner MICRO COMPONENTS LTD

Inventors MIRSKY, Uri; NEFTIN, Shimon; FURER, Lev; SEZIN, Nina; DUKHOVNY, Leonid

Pub. Number AU-A-2003286390

PCT Number PCT/IL2003/0010

PCT Pub. Number WO2004/049424

Priority 60/429,352 27.11.02 US

Filing date 27 November 2003

Wipo publication date 18 June 2004

International Classifications

H01L 021/44 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 023/34 Details of semiconductor or other solid state devices - Arrangements for cooling, heating, ventilating or temperature compensation

H01L 021/48 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/50 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

1 April 2004 Complete Application Filed

  Priority application(s): 60/429,352 27.11.02 US

22 July 2004 Application Open to Public Inspection

  Published as AU-A-2003286390

11 August 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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