HIGH DENSITY PACKAGE INTERCONNECT POWER AND GROUND STRAP AND METHOD THEREFOR

Details for Australian Patent Application No. 2003286293 (hide)

Owner KONINKLIJKE PHILIPS ELECTRONICS N.V.

Inventors WYLAND, Chris

Pub. Number AU-A-2003286293

PCT Number PCT/IB2003/0056

PCT Pub. Number WO2004/053986

Priority 60/432,482 10.12.02 US

Filing date 4 December 2003

Wipo publication date 30 June 2004

International Classifications

H01L 023/64 Details of semiconductor or other solid state devices

H01L 023/498 Details of semiconductor or other solid state devices

Event Publications

1 April 2004 Complete Application Filed

  Priority application(s): 60/432,482 10.12.02 US

5 August 2004 Application Open to Public Inspection

  Published as AU-A-2003286293

25 August 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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