ADHESIVE COMPOSITION, ADHESIVE COMPOSITION FOR CIRCUIT CONNECTION, CONNECTED CIRCUIT STRUCTURE, AND SEMICONDUCTOR DEVICES

Details for Australian Patent Application No. 2003284508 (hide)

Owner HITACHI CHEMICAL CO., LTD.

Inventors SUTO, Hoko; YUSA, Masami; KATOGI, Shigeki

Pub. Number AU-A-2003284508

PCT Number PCT/JP2003/0153

PCT Pub. Number WO2004/050779

Priority 2002-348026 29.11.02 JP

Filing date 1 December 2003

Wipo publication date 23 June 2004

International Classifications

C09J 004/02 Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond - Acrylmonomers

C09J 009/02 Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks

H05K 003/36 Apparatus or processes for manufacturing printed circuits - Assembling printed circuits with other printed circuits

H01R 011/01 Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts - characterised by the form or arrangement of the conductive interconnection between their connecting locations

H01L 021/60 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/56 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

25 March 2004 Complete Application Filed

  Priority application(s): 2002-348026 29.11.02 JP

29 July 2004 Application Open to Public Inspection

  Published as AU-A-2003284508

18 August 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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