METHOD AND DEVICE FOR JOINING

Details for Australian Patent Application No. 2003284473 (hide)

Owner TORAY ENGINEERING CO., LTD.

Inventors YAMAUCHI, Akira

Pub. Number AU-A-2003284473

PCT Number PCT/JP2003/0151

PCT Pub. Number WO2004/049427

Priority 2002-345306 28.11.02 JP

Filing date 27 November 2003

Wipo publication date 18 June 2004

International Classifications

H01L 021/60 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

C04B 037/00 Joining burned ceramic articles with other burned ceramic articles or other articles by heating

H01L 021/02 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof -

H01L 021/52 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H05K 003/26 Apparatus or processes for manufacturing printed circuits - Cleaning or polishing of the conductive pattern

Event Publications

25 March 2004 Complete Application Filed

  Priority application(s): 2002-345306 28.11.02 JP

22 July 2004 Application Open to Public Inspection

  Published as AU-A-2003284473

11 August 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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