SEMICONDUCTOR MULTILAYER INTERCONNECTION FORMING METHOD

Details for Australian Patent Application No. 2003284465 (hide)

Owner TOKYO OHKA KOGYO CO., LTD.

Inventors HAGIWARA, Yoshio; TANAKA, Takeshi

Pub. Number AU-A-2003284465

PCT Number PCT/JP2003/0151

PCT Pub. Number WO2004/051740

Priority 2002-343866 27.11.02 JP; 2002-343865 27.11.02 JP

Filing date 27 November 2003

Wipo publication date 23 June 2004

International Classifications

H01L 021/768 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/3213 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/3205 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

25 March 2004 Complete Application Filed

  Priority application(s): 2002-343866 27.11.02 JP; 2002-343865 27.11.02 JP

29 July 2004 Application Open to Public Inspection

  Published as AU-A-2003284465

11 August 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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