METHOD FOR MAINTAINING SOLDER THICKNESS IN FLIPCHIP ATTACH PACKAGING PROCESSES

Details for Australian Patent Application No. 2003283992 (hide)

Owner FAIRCHILD SEMICONDUCTOR CORPORATION

Inventors TANGPUZ, Consuelo, N.; MANATAD, Romel, N.; RIOS, Margie, T.; CRUZ, Erwin, Victor, R.

Pub. Number AU-A-2003283992

PCT Number PCT/US2003/0312

PCT Pub. Number WO2004/032198

Priority 60/417,800 03.10.02 US; 10/678,010 02.10.03 US

Filing date 3 October 2003

Wipo publication date 23 April 2004

Event Publications

25 March 2004 Complete Application Filed

  Priority application(s): 60/417,800 03.10.02 US; 10/678,010 02.10.03 US

27 May 2004 Application Open to Public Inspection

  Published as AU-A-2003283992

21 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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