THERMOSETTING RESIN COMPOSITION AND ADHESIVE FILM

Details for Australian Patent Application No. 2003281688 (hide)

Owner SUMITOMO CHEMICAL COMPANY, LIMITED

Inventors MORI, Toshiki; FUJIKI, Toru

Pub. Number AU-A-2003281688

PCT Number PCT/JP2003/0091

PCT Pub. Number WO2004/011521

Priority 2002-219298 29.07.02 JP; 2002-253218 30.08.02 JP

Filing date 18 July 2003

Wipo publication date 16 February 2004

International Classifications

C08G 059/20 Polycondensates containing more than one epoxy group per molecule

C08G 059/50 Polycondensates containing more than one epoxy group per molecule

C09J 007/00 Adhesives in the form of films or foils

C09J 163/00 Adhesives based on epoxy resins

Event Publications

11 March 2004 Complete Application Filed

  Priority application(s): 2002-219298 29.07.02 JP; 2002-253218 30.08.02 JP

25 March 2004 Application Open to Public Inspection

  Published as AU-A-2003281688

21 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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