SEMICONDUCTOR ABRASIVE, PROCESS FOR PRODUCING THE SAME AND METHOD OF POLISHING

Details for Australian Patent Application No. 2003281655 (hide)

Owner SEIMI CHEMICAL CO., LTD.

Inventors KON, Yoshinori; NAKAZAWA, Norihito; ISHIDA, Chie

Pub. Number AU-A-2003281655

PCT Number PCT/JP2003/0092

PCT Pub. Number WO2004/010487

Priority 2002-212679 22.07.02 JP

Filing date 22 July 2003

Wipo publication date 9 February 2004

International Classifications

H01L 021/304 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

4 March 2004 Complete Application Filed

  Priority application(s): 2002-212679 22.07.02 JP

18 March 2004 Application Open to Public Inspection

  Published as AU-A-2003281655

21 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

25 August 2005 Corrigenda

  Applications OPI - Name Index Under the name SEIMI CHEMICAL CO., LTD., Application No. 2003281655, under INID (71) correct the name to read ASAHI GLASS COMPANY, LIMITED; SEIMI CHEMICAL CO., LTD.

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