WIRING PATTERN STRUCTURE AND METHOD FOR FORMING BUMP

Details for Australian Patent Application No. 2003281445 (hide)

Owner SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventors HIRAKAWA, Eichi; MIYAZAWA, Satoshi

Pub. Number AU-A-2003281445

PCT Number PCT/JP2003/0084

PCT Pub. Number WO2004/006637

Priority 2002-198891 08.07.02 JP

Filing date 3 July 2003

Wipo publication date 23 January 2004

International Classifications

H05K 003/34 Apparatus or processes for manufacturing printed circuits - by soldering

H01L 023/12 Details of semiconductor or other solid state devices - Mountings, e.g. non-detachable insulating substrates

H01L 021/60 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

4 March 2004 Complete Application Filed

  Priority application(s): 2002-198891 08.07.02 JP

11 March 2004 Application Open to Public Inspection

  Published as AU-A-2003281445

21 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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