WAFER PROCESSING SYSTEM, COATING/DEVELOPING APPARATUS, AND WAFER PROCESSING APPARATUS

Details for Australian Patent Application No. 2003280854 (hide)

Owner TOKYO ELECTRON LIMITED

Inventors MIYATA, Akira; HIGASHI, Makio

Pub. Number AU-A-2003280854

PCT Number PCT/JP03/14673

PCT Pub. Number WO2004/049408

Priority 2002-346138 28.11.02 JP

Filing date 18 November 2003

Wipo publication date 18 June 2004

International Classifications

H01L 021/027 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

G03F 007/20 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces - Exposure

Event Publications

4 March 2004 Complete Application Filed

  Priority application(s): 2002-346138 28.11.02 JP

22 July 2004 Application Open to Public Inspection

  Published as AU-A-2003280854

11 August 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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