SOLDERING METHOD AND DEVICE

Details for Australian Patent Application No. 2003280631 (hide)

Owner TECHNO LAB COMPANY

Inventors FUJINO, Takashi; FUKAMACHI, Atsushi; FUKAMACHI, Shimpei; OTANI, Hirokazu

Pub. Number AU-A-2003280631

PCT Number PCT/JP03/13903

PCT Pub. Number WO2004/039526

Priority 2002-320097 01.11.02 JP; 2003-44766 21.02.03 JP

Filing date 30 October 2003

Wipo publication date 25 May 2004

International Classifications

B23K 001/20 Soldering, e.g. brazing, or unsoldering - Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating

B23K 035/26 Rods, electrodes, materials, or media, for use in soldering, welding, or cutting - with the principal constituent melting at less than 400°C

H05K 003/34 Apparatus or processes for manufacturing printed circuits - by soldering

Event Publications

26 February 2004 Complete Application Filed

  Priority application(s): 2002-320097 01.11.02 JP; 2003-44766 21.02.03 JP

24 June 2004 Application Open to Public Inspection

  Published as AU-A-2003280631

21 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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