LOW STRESS SEMICONDUCTOR DIE ATTACH

Details for Australian Patent Application No. 2003279079 (hide)

Owner MOTOROLA, INC.

Inventors CONDIE, Brian, W.; DOUGHERTY, David, J.

Pub. Number AU-A-2003279079

PCT Number PCT/US03/30862

PCT Pub. Number WO2004/061936

Priority 10/334,042 30.12.02 US

Filing date 30 September 2003

Wipo publication date 29 July 2004

International Classifications

H01L 021/60 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

26 February 2004 Complete Application Filed

  Priority application(s): 10/334,042 30.12.02 US

2 September 2004 Application Open to Public Inspection

  Published as AU-A-2003279079

15 September 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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